FormFactor, Teradyne Enter Broad Semiconductor Test Collaboration

FormFactor and Teradyne have entered into a broad technology collaboration aimed at next-generation semiconductor testing, the companies said in a joint announcement on October 12, 2026, with Teradyne also agreeing to make a $300 million strategic equity investment in FormFactor common stock.

The collaboration pairs FormFactor’s expertise in probe technologies, interface solutions, test engineering, and device characterization with Teradyne’s automated test platforms. The release identifies FormFactor as a provider of semiconductor test and measurement technologies and Teradyne as a provider of automated test equipment and advanced robotics, and describes the collaboration as combining the two companies’ positions in probe, interface, and test technologies to accelerate AI and high-performance compute deployments.

According to the announcement, the collaboration is aimed at accelerating the development, validation, and high-volume production deployment of next-generation semiconductor devices and at helping customers address growing semiconductor complexity. The companies said they will partner to advance semiconductor test architectures, optimize test infrastructure, and enhance production readiness for existing and emerging applications, including high-performance compute, advanced packaging, high-bandwidth memory, and silicon photonics.

The companies said they believe the collaboration will accelerate innovation across the semiconductor test ecosystem, from wafer to data center. They also said they expect the partnership to expand opportunities for joint customer engagement and to support increasing demand for advanced computing, AI infrastructure, and next-generation semiconductor technologies.

$300 Million Equity Investment

Under the terms of the agreement, Teradyne has agreed to purchase shares of FormFactor common stock in a $300 million strategic equity investment. The transaction is subject to customary closing conditions and regulatory approvals, the companies said.

Statements From Both Chief Executives

FormFactor Chief Executive Officer Mike Slessor said the semiconductor industry is entering a period in which test performance, scalability, and time-to-market are becoming decisive competitive advantages. He said combining FormFactor’s expertise in device characterization, probing, interfaces, and production test solutions with Teradyne’s test platforms can help customers accelerate innovation and move more efficiently from technology development to high-volume manufacturing.

Teradyne President and Chief Executive Officer Gregory Smith said the most demanding test challenges in advanced packaging, silicon photonics, and memory cannot be solved by a single company. He said that investing in FormFactor and combining Teradyne’s test platforms with FormFactor’s probe and interface expertise builds what he described as a more complete, validated path to production for the two companies’ shared customers, while reinforcing the company’s commitment to an open, interoperable ecosystem.

Recent Announcements at Each Company

Teradyne’s official newsroom index lists the following 2026 announcements. On April 16, 2026, Teradyne acquired TestInsight, a deal the company described as accelerating time to market for AI and data center devices. On June 8, 2026, it introduced an integrated test solution for AI and data center devices in collaboration with Tokyo Electron. Teradyne launched advanced UltraFLEXplus instruments engineered for AI and data center computing devices on September 1, 2026. On September 14, 2026, the company opened an office in India, a move it described as deepening its commitment to the country’s growing semiconductor ecosystem. It announced the Magnum E2 on September 29, 2026 to address next-generation memory test demands driven by AI and high-performance computing, and introduced the Titan HP platform with burn-in capabilities for advanced AI data center devices on October 6, 2026. On October 12, 2026, the date of the collaboration announcement, Teradyne introduced the UltraFLEXplus S Series for edge AI applications.

FormFactor’s investor-relations release index shows the company was added to the US large-cap Russell 1000 Index effective June 29, 2026. On July 28, 2026, FormFactor announced a strategic partnership with Keystone Microtech to expand semiconductor probe card manufacturing and test capabilities for advanced semiconductor applications, in a release datelined Livermore, California and Zhubei, Taiwan. On July 29, 2026, the company reported its second-quarter 2026 results, which it said delivered record revenue, gross profit, and earnings per share, and said it saw strong demand in DRAM, foundry and logic, and systems. FormFactor is scheduled to report its third-quarter 2026 financial results on October 28, 2026.